Effect of coupling agents on thermal, flow, and adhesion properties of epoxy/silica compounds for capillary underfill applications

Published 2012 View Full Article

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Title
Effect of coupling agents on thermal, flow, and adhesion properties of epoxy/silica compounds for capillary underfill applications
Authors
Keywords
-
Journal
POWDER TECHNOLOGY
Volume 230, Issue -, Pages 145-150
Publisher
Elsevier BV
Online
2012-07-16
DOI
10.1016/j.powtec.2012.07.022

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