Effect of coupling agents on thermal, flow, and adhesion properties of epoxy/silica compounds for capillary underfill applications

标题
Effect of coupling agents on thermal, flow, and adhesion properties of epoxy/silica compounds for capillary underfill applications
作者
关键词
-
出版物
POWDER TECHNOLOGY
Volume 230, Issue -, Pages 145-150
出版商
Elsevier BV
发表日期
2012-07-16
DOI
10.1016/j.powtec.2012.07.022

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