Microfluidic chip fabrication using hot embossing and thermal bonding of COP

Published 2009 View Full Article

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Title
Microfluidic chip fabrication using hot embossing and thermal bonding of COP
Authors
Keywords
-
Journal
POLYMERS FOR ADVANCED TECHNOLOGIES
Volume 21, Issue 7, Pages 457-466
Publisher
Wiley
Online
2009-05-04
DOI
10.1002/pat.1447

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