Microfluidic chip fabrication using hot embossing and thermal bonding of COP

标题
Microfluidic chip fabrication using hot embossing and thermal bonding of COP
作者
关键词
-
出版物
POLYMERS FOR ADVANCED TECHNOLOGIES
Volume 21, Issue 7, Pages 457-466
出版商
Wiley
发表日期
2009-05-04
DOI
10.1002/pat.1447

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