Effect of boron addition on interface microstructure and thermal conductivity of Cu/diamond composites produced by high temperature-high pressure method
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Title
Effect of boron addition on interface microstructure and thermal conductivity of Cu/diamond composites produced by high temperature-high pressure method
Authors
Keywords
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Journal
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE
Volume 211, Issue 3, Pages 587-594
Publisher
Wiley
Online
2013-11-12
DOI
10.1002/pssa.201330237
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