Journal
MATERIALS & DESIGN
Volume 45, Issue -, Pages 36-42Publisher
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2012.09.006
Keywords
Cu/diamond composites; Microstructure; Thermal conductivity; Modeling
Categories
Funding
- National Natural Science Fund of China [50971020, 51165021]
- Gansu Province Science Fund [111RJDA0103]
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Interfaces and close proximity between the diamond and the metal matrix are very important for their thermal conductance performance. Matrix-alloying is a useful approach to greatly enhance the interfacial bonding and thermal conductivity. In this study, the copper-diamond (Cu/Dia) composites with addition of 0.8, 1.2 and 2.4 wt.% zirconium (Zr) are prepared to investigate the influence of minor addition of Zr on the microstructure and thermal conductivity of the composites. The thermal conductivity of the composites is analyzed both experimentally and theoretically. It is demonstrated that moderate interfacial modification due to the Zr added is beneficial to improve the thermal conductivity of the Cu/Dia composites. (c) 2012 Elsevier Ltd. All rights reserved.
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