Restrictions of stress measurements using the curvature method by thermally induced plastic deformation of silicon substrates

Published 2015 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Restrictions of stress measurements using the curvature method by thermally induced plastic deformation of silicon substrates
Authors
Keywords
Curvature method, Hard coatings, Plastic substrate deformation, Residual stress, Biaxial stress–temperature measurement
Journal
SURFACE & COATINGS TECHNOLOGY
Volume 274, Issue -, Pages 68-75
Publisher
Elsevier BV
Online
2015-04-26
DOI
10.1016/j.surfcoat.2015.04.038

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.