FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process

Published 2012 View Full Article

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Title
FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 53, Issue 4, Pages 600-611
Publisher
Elsevier BV
Online
2012-11-23
DOI
10.1016/j.microrel.2012.10.015

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