Encapsulate-and-peel: fabricating carbon nanotube CMOS integrated circuits in a flexible ultra-thin plastic film
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Title
Encapsulate-and-peel: fabricating carbon nanotube CMOS integrated circuits in a flexible ultra-thin plastic film
Authors
Keywords
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Journal
NANOTECHNOLOGY
Volume 25, Issue 6, Pages 065301
Publisher
IOP Publishing
Online
2014-01-18
DOI
10.1088/0957-4484/25/6/065301
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