Self-constructed tree-shape high thermal conductivity nanosilver networks in epoxy
Published 2014 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Self-constructed tree-shape high thermal conductivity nanosilver networks in epoxy
Authors
Keywords
-
Journal
Nanoscale
Volume 6, Issue 8, Pages 4292-4296
Publisher
Royal Society of Chemistry (RSC)
Online
2014-01-29
DOI
10.1039/c3nr06494h
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Nanowire-filled polymer composites with ultrahigh thermal conductivity
- (2013) Nikhil Balachander et al. APPLIED PHYSICS LETTERS
- Thermally Reversible Aggregation of Gold Nanoparticles in Polymer Nanocomposites through Hydrogen Bonding
- (2013) Kyuyoung Heo et al. NANO LETTERS
- High thermal conductivity epoxy-silver composites based on self-constructed nanostructured metallic networks
- (2012) Kamyar Pashayi et al. JOURNAL OF APPLIED PHYSICS
- Preparation of Dendritic Nanostructures of Silver and Their Characterization for Electroreduction
- (2012) Xia Qin et al. LANGMUIR
- Graphene–Multilayer Graphene Nanocomposites as Highly Efficient Thermal Interface Materials
- (2012) Khan M. F. Shahil et al. NANO LETTERS
- Growth of non-branching Ag nanowiresvia ion migrational-transport controlled 3D electrodeposition
- (2011) Chunhua Ding et al. CRYSTENGCOMM
- Mechanical properties of nano-silver joints as die attach materials
- (2011) Kim S. Siow JOURNAL OF ALLOYS AND COMPOUNDS
- Electrospun Nano Composites of Poly(vinyl pyrrolidone)/Nano-Silver for Antibacterial Materials
- (2011) Suyeon Hwang et al. JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
- Synergistic antibacterial activity of chitosan–silver nanocomposites onStaphylococcus aureus
- (2011) Monica Potara et al. NANOTECHNOLOGY
- Low temperature sintering of Ag nanoparticles for flexible electronics packaging
- (2010) A. Hu et al. APPLIED PHYSICS LETTERS
- Ferroelectric polymer/silver nanocomposites with high dielectric constant and high thermal conductivity
- (2009) Xingyi Huang et al. APPLIED PHYSICS LETTERS
- Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips
- (2009) T.G. Lei et al. IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
- Evaluation of a thermal interface material fabricated using thermocompression bonding of carbon nanotube turf
- (2009) A Hamdan et al. NANOTECHNOLOGY
- The rheology of suspensions of solid particles
- (2009) S. Mueller et al. PROCEEDINGS OF THE ROYAL SOCIETY A-MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES
- Sinterability and conductivity of silver paste with Pb-free frit
- (2008) D.S. Seo et al. CURRENT APPLIED PHYSICS
- Effect of aggregation and interfacial thermal resistance on thermal conductivity of nanocomposites and colloidal nanofluids
- (2008) William Evans et al. INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
- Inkjet-printed silver tracks: low temperature curing and thermal stability investigation
- (2008) By Jolke Perelaer et al. JOURNAL OF MATERIALS CHEMISTRY
- Preparation of monodisperse Se colloid spheres and Se nanowires using Na2SeSO3 as precursor
- (2008) Liping Liu et al. Nano Research
Find Funding. Review Successful Grants.
Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.
ExplorePublish scientific posters with Peeref
Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.
Learn More