Application of Aerosol Jet technology in through-via interconnection for MEMS wafer-level packaging

Published 2014 View Full Article

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Title
Application of Aerosol Jet technology in through-via interconnection for MEMS wafer-level packaging
Authors
Keywords
Wire Bonding, Annular Flow, Dope Silicon, Trapezium Shape, Sheath Flow
Journal
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume 21, Issue 2, Pages 451-455
Publisher
Springer Nature
Online
2014-02-17
DOI
10.1007/s00542-014-2107-x
References
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