Application of Aerosol Jet technology in through-via interconnection for MEMS wafer-level packaging

出版年份 2014 全文链接

标题

作者

关键词

Wire Bonding, Annular Flow, Dope Silicon, Trapezium Shape, Sheath Flow

出版物

Volume 21, Issue 2, Pages 451-455

出版商

Springer Nature

发表日期

2014-02-17

DOI

10.1007/s00542-014-2107-x

参考文献

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