Investigations of development process of high hollow beveled microneedles using a combination of ICP RIE and dicing saw

Published 2008 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Investigations of development process of high hollow beveled microneedles using a combination of ICP RIE and dicing saw
Authors
Keywords
-
Journal
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS
Volume 14, Issue 9-11, Pages 1475-1480
Publisher
Springer Nature
Online
2008-03-03
DOI
10.1007/s00542-008-0596-1

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.