Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32nm and beyond

Published 2012 View Full Article

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Title
Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32nm and beyond
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 53, Issue 2, Pages 229-235
Publisher
Elsevier BV
Online
2012-10-03
DOI
10.1016/j.microrel.2012.08.015

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