Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique

Published 2013 View Full Article

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Title
Reliability analysis of solder joints due to creep and fatigue in microelectronic packaging using microindentation technique
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 53, Issue 5, Pages 761-766
Publisher
Elsevier BV
Online
2013-03-08
DOI
10.1016/j.microrel.2013.01.008

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