Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package

Published 2011 View Full Article

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Title
Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 52, Issue 5, Pages 855-860
Publisher
Elsevier BV
Online
2011-06-27
DOI
10.1016/j.microrel.2011.05.002

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