Nanoadhesion layer for enhanced Si–Si and Si–SiN wafer bonding

Published 2011 View Full Article

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Title
Nanoadhesion layer for enhanced Si–Si and Si–SiN wafer bonding
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 52, Issue 2, Pages 342-346
Publisher
Elsevier BV
Online
2011-01-15
DOI
10.1016/j.microrel.2010.12.006

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