A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization

Title
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization
Authors
Keywords
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Journal
MICROELECTRONICS RELIABILITY
Volume 52, Issue 9-10, Pages 2321-2325
Publisher
Elsevier BV
Online
2012-08-17
DOI
10.1016/j.microrel.2012.06.121

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