Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging

Title
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging
Authors
Keywords
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Journal
MICROELECTRONICS RELIABILITY
Volume 52, Issue 6, Pages 1165-1173
Publisher
Elsevier BV
Online
2011-12-24
DOI
10.1016/j.microrel.2011.12.004

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