Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

Published 2012 View Full Article

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Title
Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 52, Issue 11, Pages 2677-2684
Publisher
Elsevier BV
Online
2012-07-16
DOI
10.1016/j.microrel.2012.06.024

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