Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory

Published 2011 View Full Article

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Title
Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 51, Issue 12, Pages 2298-2305
Publisher
Elsevier BV
Online
2011-07-05
DOI
10.1016/j.microrel.2011.05.011

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