New conductive thick-film paste based on silver nanopowder for high power and high temperature applications

Title
New conductive thick-film paste based on silver nanopowder for high power and high temperature applications
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 51, Issue 7, Pages 1235-1240
Publisher
Elsevier BV
Online
2011-05-23
DOI
10.1016/j.microrel.2011.04.015

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