Enhancing bondability with coated copper bonding wire

Title
Enhancing bondability with coated copper bonding wire
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 51, Issue 1, Pages 88-96
Publisher
Elsevier BV
Online
2010-06-02
DOI
10.1016/j.microrel.2010.04.014

Ask authors/readers for more resources

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now