Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA

Published 2011 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 51, Issue 8, Pages 1372-1376
Publisher
Elsevier BV
Online
2011-04-16
DOI
10.1016/j.microrel.2011.03.025

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.