Analysis of large area Trench-IGBT current distribution under UIS test with the aid of lock-in thermography

Published 2010 View Full Article

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Title
Analysis of large area Trench-IGBT current distribution under UIS test with the aid of lock-in thermography
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 50, Issue 9-11, Pages 1725-1730
Publisher
Elsevier BV
Online
2010-08-12
DOI
10.1016/j.microrel.2010.07.072

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