Mechanical properties versus temperature relation of individual phases in Sn–3.0Ag–0.5Cu lead-free solder alloy

Published 2008 View Full Article

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Title
Mechanical properties versus temperature relation of individual phases in Sn–3.0Ag–0.5Cu lead-free solder alloy
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 49, Issue 3, Pages 296-302
Publisher
Elsevier BV
Online
2008-11-30
DOI
10.1016/j.microrel.2008.10.010

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