Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs

Published 2007 View Full Article

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Title
Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs
Authors
Keywords
-
Journal
MICROELECTRONICS RELIABILITY
Volume 48, Issue 4, Pages 645-651
Publisher
Elsevier BV
Online
2007-12-07
DOI
10.1016/j.microrel.2007.10.004

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