Article
Materials Science, Multidisciplinary
Sukrut Prashant Phansalkar, Changsu Kim, Bongtae Han, Przemyslaw Jakub Gromala
JOURNAL OF MATERIALS SCIENCE
(2020)
Article
Engineering, Manufacturing
Artur Roman, Bulong Wu, Bongtae Han, Gesche Mareike Reinacher, Susan Galal Yousef
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
(2020)
Article
Optics
K. J. Kim, B. Han, A. Bar-Cohen
Summary: The study shows that the total thermal resistance value of the micro-pin fin cooler is only 1/3 of that of the micro-gap cooler, significantly reducing the LD operating temperature and improving efficiency. Experimental results demonstrate a 20% increase in optical power for LD bars operating at -100 degrees Celsius compared to 41 degrees Celsius.
APPLIED PHYSICS B-LASERS AND OPTICS
(2021)
Article
Polymer Science
Changsu Kim, Sukrut Prashant Phansalkar, Hyun-Seop Lee, Bongtae Han
Summary: A two-stage curing process has been developed to measure the effective cure shrinkage in an epoxy-based molding compound using an embedded fiber Bragg grating sensor. Technical considerations were taken to ensure uniform curing and accurate measurement of the EMC with a filler content of 88 wt%, resulting in a measured ECS value of 0.077% with confirmed repeatability.
JOURNAL OF APPLIED POLYMER SCIENCE
(2022)
Article
Engineering, Electrical & Electronic
Alexandru Prisacaru, Ernesto Oquelis Guerrero, Balakrishna Chimmineni, Przemyslaw Jakub Gromala, Yu-Hsiang Yang, Bongtae Han, Guo Qi Zhang
Summary: The study uses piezoresistive silicon stress sensors to monitor internal stresses in electronic packages, and utilizes machine learning and surrogate models to predict out of plane stresses in delaminated regions. Through experiments and simulations, results consistent with scanning acoustic microscope images are obtained.
MICROELECTRONICS RELIABILITY
(2021)
Article
Polymer Science
Adwait Inamdar, Yu-Hsiang Yang, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han
Summary: This study investigates the oxidation of epoxy-based molding compounds (EMC) under high temperature conditions, examining the oxidation growth process, critical thermomechanical properties of oxidized EMC, and the impact of oxidation on the thermomechanical behavior of electronic packaging. The results show that EMC oxidizes rapidly at high temperatures, forming an oxidized layer with distinct properties.
POLYMER DEGRADATION AND STABILITY
(2021)
Article
Chemistry, Physical
Yu-Hsiang Yang, Hsiu-Ping Wei, Bongtae Han, Chao Hu
Summary: The study successfully utilized the Bivariate Cut High Dimensional Model Representation technique to construct a metamodel for a semiconductor packaging design problem with 10 design variables, demonstrating higher efficiency and accuracy compared to the Central Composite Design method.
Article
Chemistry, Multidisciplinary
Kyoung Joon Kim, Hyeon Ho Yang, Wooheon Noh, Bongtae Han, Avram Bar-Cohen
Summary: Experimental study demonstrates that the cryogenic micro-pin fin cooler with two-phase liquid nitrogen flows has a significantly higher base heat transfer coefficient compared to the FC-72 flows. The research also shows that the base heat transfer coefficient of the micro-pin fin cooler is nearly three times greater than that of the micro-gap cooler without fins, indicating the feasibility of using the former for thermally controlling high heat density devices like high-power laser diode bars.
APPLIED SCIENCES-BASEL
(2021)
Article
Automation & Control Systems
Alexandru Prisacaru, Przemyslaw Jakub Gromala, Bongtae Han, Gui Qi Zhang
Summary: Recent trends in automotive electronics will increase the complexity and quantity of electronics used in safety-relevant applications. This article proposes a thermomechanical stress-based prognostics method as a potential solution and validates it through experimental, data management, and statistical techniques.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
(2022)
Review
Engineering, Electrical & Electronic
Sukrut Prashant Phansalkar, Changsu Kim, Bongtae Han
Summary: This review paper examines the effect of critical epoxy molding compound (EMC) properties on the warpage behavior of semiconductor packages. Despite considerable efforts made to enhance predictability, accurate prediction still remains a challenging task. The paper identifies three potential causes that make prediction difficult and discusses measures to improve prediction capability.
MICROELECTRONICS RELIABILITY
(2022)
Proceedings Paper
Engineering, Electrical & Electronic
Ran Tao, Sukrut Prashant Phansalkar, Aaron M. Forster, Bongtae Han
Summary: In this study, a second reaction exotherm was identified in commercial multi-resin EMC systems using differential scanning calorimetry (DSC), which is critical for designing cure schedules in manufacturing processes.
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC
(2023)
Proceedings Paper
Engineering, Electrical & Electronic
Sukrut Phansalkar, Changsu Kim, Bongtae Han
Summary: This paper discusses the simulation of electronic packages using advanced computational mechanics techniques and commercial tools, as well as the challenges in accurately predicting warpage and the steps that should be taken to improve prediction capability.
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)
(2021)
Proceedings Paper
Engineering, Electrical & Electronic
Sukrut Prashant Phansalkar, Yu-Hsiang Yang, Changsu Kim, Bongtae Han, Young Kun Jee, Choong Seon Lee, Un Byung Kang, Jong Ho Lee, Sang Cheon
Summary: Three mechanical properties of Benzo cyclobutene (BCB) were characterized using various testing methods, including optical strain sensor, DMA testing, and hydrostatic testing, resulting in the determination of bulk modulus for the material.
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)
(2021)
Proceedings Paper
Engineering, Electrical & Electronic
Daniel Riegel, Przemyslaw Jakub Gromala, Bongtae Han, Sven Rzepka
Summary: In this study, in-situ measurements of on-chip stress sensors were used to generate run-to-failure data sets, with physical failure analysis establishing the link between data and remaining useful life, enabling predictive maintenance of components.
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)
(2021)
Proceedings Paper
Thermodynamics
Daniel Riegel, Przemyslaw Jakub Gromala, Bongtae Han, Sven Rzepka
Summary: The lifetime of electronic systems is influenced by various factors, with a focus on thermal load conditions in this study. A meta-model was developed to calculate temperatures at different points in the system based on virtual sensors and experimental data. The external ambient temperature and internal heat generated by component operation contribute to the thermal load affecting the system's lifespan.
PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021)
(2021)
Article
Engineering, Electrical & Electronic
Zhiqiang Wang, Siyang Dai, Yao Zhao, Guofeng Li, Bing Ji, Volker Pickert, Bowen Gu, Shuai Ding
Summary: This paper proposes a lumped-charge model for IEGT single chip, considering the effect of carrier injection enhancement in the emitter. The parasitic inductance of the parallel branches in PP-IEGT is extracted using Ansys simulation, and the validity of Ansys simulation is verified. Furthermore, the switching inconsistency is evaluated by combining the electrical model and the effect of mutual inductance, and it is found that mutual inductance is an important factor influencing electrical parameter distribution.
MICROELECTRONICS RELIABILITY
(2024)
Article
Engineering, Electrical & Electronic
Sankha Subhra Ghosh, Surajit Chattopadhyay, Arabinda Das, Nageswara Rao Medikondu, Abdulkarem H. M. Almawgani, Adam R. H. Alhawari, Sudipta Das
Summary: This article describes a method for identifying the IGBT switch breakdown failure in a 3-phase, 3-level Voltage Source Converter linked to the photovoltaic grid. Comparative learning has been used to detect the specific parameter suitable for the detection of the failure.
MICROELECTRONICS RELIABILITY
(2024)
Article
Engineering, Electrical & Electronic
Milad Khajehvand, Henri Seppanen, Panthea Sepehrband
Summary: Using SEM/EDX analysis, microscale fracture at the bond-pad is detected during the wedge bonding process of Cu wire to a Cu or Al substrate. It is observed that the fracture of the bond leads to the formation of a bulge on the wire and a cavity in the substrate, causing fracture in the original substrate. 3D optical profiler reveals that the depth, radius, and surface area of the cavity increase with bond time for a constant bond force and power. These metrics are suggested as new factors for optimizing the wedge bonding process. The optimal bonding parameters should maximize the cavity's surface area (related to bond's pull force) while minimizing the cavity's depth relative to the substrate's thickness to avoid substrate damage. Furthermore, Molecular Dynamics simulations propose a potential plastic deformation mechanism for bond-pad damage, suggesting the benefits of using a small-grain-sized substrate, low transducer's vibration amplitude, and high transducer's frequency to minimize the cavity's depth.
MICROELECTRONICS RELIABILITY
(2024)