Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography

标题
Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography
作者
关键词
-
出版物
MICROELECTRONIC ENGINEERING
Volume 87, Issue 4, Pages 553-559
出版商
Elsevier BV
发表日期
2009-08-26
DOI
10.1016/j.mee.2009.08.007

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