Soft UV-NIL at 20nm scale using flexible bi-layer stamp casted on HSQ master mold

Title
Soft UV-NIL at 20nm scale using flexible bi-layer stamp casted on HSQ master mold
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 87, Issue 5-8, Pages 1015-1018
Publisher
Elsevier BV
Online
2009-11-28
DOI
10.1016/j.mee.2009.11.106

Ask authors/readers for more resources

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started