Soft UV-NIL at 20nm scale using flexible bi-layer stamp casted on HSQ master mold

标题
Soft UV-NIL at 20nm scale using flexible bi-layer stamp casted on HSQ master mold
作者
关键词
-
出版物
MICROELECTRONIC ENGINEERING
Volume 87, Issue 5-8, Pages 1015-1018
出版商
Elsevier BV
发表日期
2009-11-28
DOI
10.1016/j.mee.2009.11.106

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