Characterization of sputtered tungsten nitride film and its application to Cu electroless plating

Published 2007 View Full Article

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Title
Characterization of sputtered tungsten nitride film and its application to Cu electroless plating
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 85, Issue 2, Pages 395-400
Publisher
Elsevier BV
Online
2007-08-14
DOI
10.1016/j.mee.2007.07.017

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