Characterization of sputtered tungsten nitride film and its application to Cu electroless plating

标题
Characterization of sputtered tungsten nitride film and its application to Cu electroless plating
作者
关键词
-
出版物
MICROELECTRONIC ENGINEERING
Volume 85, Issue 2, Pages 395-400
出版商
Elsevier BV
发表日期
2007-08-14
DOI
10.1016/j.mee.2007.07.017

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