Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface

Published 2008 View Full Article

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Title
Effect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface
Authors
Keywords
-
Journal
MATERIALS TRANSACTIONS
Volume 49, Issue 7, Pages 1518-1523
Publisher
Japan Institute of Metals
Online
2008-06-25
DOI
10.2320/matertrans.mf200851

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