4.6 Article

Cu diffusion along Al grain boundaries

Journal

MATERIALS LETTERS
Volume 62, Issue 30, Pages 4477-4479

Publisher

ELSEVIER SCIENCE BV
DOI: 10.1016/j.matlet.2008.07.059

Keywords

Diffusion; Grain boundaries; Aluminum; Copper

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Cu grain boundary diffusion (GBD) in Al was investigated by EPMA in temperature range from 300 to 400 degrees C. The triple product s delta D-gb (s-segregation coefficient, delta-grain boundary width, D-gb-GBD coefficient) was calculated due to Fisher-Gibbs solution using two methods-measuring of GB concentration in dependence on penetration depth and the contour angle (at the top of diffusion wedge). In the first case s delta D-gb=5.1 . 10(-11)m(3)/s . exp (-102 kJ/mol/RT); in the second s delta D-gb=1.4 . 10(-11)m3/s . exp(-94kJ/mol/RT). (C) 2008 Published by Elsevier B.V.

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