Journal
MATERIALS LETTERS
Volume 62, Issue 12-13, Pages 1867-1870Publisher
ELSEVIER
DOI: 10.1016/j.matlet.2007.10.027
Keywords
intermetallic alloys and compounds; microstructure; electron microscopy; diffusion; whisker; lead-free finish
Funding
- Korea Institute of Industrial Technology(KITECH) [B0008849] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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For matte tin-plated copper leadframes stored at 55 degrees C/85% relative humidity (RH) for 1800 h, nodule-shaped whiskers were observed on test samples without postbake treatment (WOPB), while no whiskers were observed on samples with postbake treatment (WPB). The WPB samples show a very regular layer of intermetallic compounds (IMCs) approximately 27% narrower than the same layer in the WOPB samples. The IMCs had two distinct layers divided into large-grains and fine-grains. The large-grain layers located on the Sn side grew before the fine-grain layers. The IMCs in the WOPB and WPB specimens were identified as CU6Sn5 (monoclinic) and eta-CU6.26Sn5 (hexagonal). (c) 2007 Published by Elsevier B. V.
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