Journal
MATERIALS CHARACTERIZATION
Volume 144, Issue -, Pages 611-620Publisher
ELSEVIER SCIENCE INC
DOI: 10.1016/j.matchar.2018.08.015
Keywords
Cu-Sn alloy; Power spinning; EBSD; TEM; Twin
Ask authors/readers for more resources
Electron back scatter diffraction pattern (EBSD), metallographic microscope (OM) and transmission electron microscope (TEM) are used to analyze the microstructural state of the Cu-Sn alloy before and after power spinning and annealing. The results show that after power spinning, the a phase grains are refined and gradually evolve into small and fine an and deformed am crystal grains, with an average grain size of about 2.2 mu m. Work hardening results in massive network-like subgrain boundaries distributed in power spinning microstructure. Annealing at 400 degrees C contributes to the formation of dislocation cells and stacking faults, and high-angle grain boundaries (HABS) start to migrate and slide. After the formation of less defective equiaxed grains at 500 degrees C, twins continue to grow and widen based through continuous accumulation of stacking faults. Further testing of mechanical properties reveals that power spinning is conducive to the improvement of mechanical properties of Cu-Sn alloy.
Authors
I am an author on this paper
Click your name to claim this paper and add it to your profile.
Reviews
Recommended
No Data Available