4.5 Article

Effect of Crystallographic Anisotropy on Micro EDM Process

Journal

MATERIALS AND MANUFACTURING PROCESSES
Volume 30, Issue 8, Pages 961-967

Publisher

TAYLOR & FRANCIS INC
DOI: 10.1080/10426914.2014.962660

Keywords

Anisotropy; Monocrystalline; Silicon; Crystal; Discharge; Electrical; Machining

Funding

  1. National Science Foundation of China [51375274]

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In this paper, experiments are conducted by machining from different crystallographic orientations of monocrystalline silicon, and the effects of crystallographic orientation on the micro electrical discharge machining (EDM) process are discussed. The results demonstrate that the machining speed and surface roughness are varied when crystallographic orientation changes. The surface roughness is seen to vary by as much as twofold with crystallographic orientation, while the ratio between the maximum and minimum values of material removal rate is 1.76. The unique material removal mechanism of micro EDM enhances the effects of crystal anisotropy on micro electrical discharge machining process.

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