Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer

Published 2013 View Full Article

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Title
Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer
Authors
Keywords
-
Journal
MATERIALS & DESIGN
Volume 52, Issue -, Pages 359-366
Publisher
Elsevier BV
Online
2013-05-31
DOI
10.1016/j.matdes.2013.05.057

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