The effect of cooling rate on the dendritic spacing and morphology of Ag3Sn intermetallic particles of a SnAg solder alloy

Published 2010 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
The effect of cooling rate on the dendritic spacing and morphology of Ag3Sn intermetallic particles of a SnAg solder alloy
Authors
Keywords
-
Journal
MATERIALS & DESIGN
Volume 32, Issue 5, Pages 3008-3012
Publisher
Elsevier BV
Online
2010-12-29
DOI
10.1016/j.matdes.2010.12.046

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.