Roll-to-roll atomic layer deposition process for flexible electronics encapsulation applications

Title
Roll-to-roll atomic layer deposition process for flexible electronics encapsulation applications
Authors
Keywords
-
Journal
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
Volume 32, Issue 5, Pages 051603
Publisher
American Vacuum Society
Online
2014-08-20
DOI
10.1116/1.4893428

Ask authors/readers for more resources

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search