Roll-to-roll atomic layer deposition process for flexible electronics encapsulation applications

标题
Roll-to-roll atomic layer deposition process for flexible electronics encapsulation applications
作者
关键词
-
出版物
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
Volume 32, Issue 5, Pages 051603
出版商
American Vacuum Society
发表日期
2014-08-20
DOI
10.1116/1.4893428

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