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Title
Pulsed high-density plasmas for advanced dry etching processes
Authors
Keywords
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Journal
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A
Volume 30, Issue 4, Pages 040801
Publisher
American Vacuum Society
Online
2012-05-31
DOI
10.1116/1.4716176
References
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Related references
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- Inductively Coupled Pulsed Plasmas in the Presence of Synchronous Pulsed Substrate Bias for Robust, Reliable, and Fine Conductor Etching
- (2009) S. Banna et al. IEEE TRANSACTIONS ON PLASMA SCIENCE
- Synchronous Pulse Plasma Operation upon Source and Bias Radio Frequencys for Inductively Coupled Plasma for Highly Reliable Gate Etching Technology
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