Effect of electrodeposition parameters on the hydrogen permeation during Cu–Sn alloy electrodeposition

Title
Effect of electrodeposition parameters on the hydrogen permeation during Cu–Sn alloy electrodeposition
Authors
Keywords
-
Journal
ELECTROCHIMICA ACTA
Volume 55, Issue 7, Pages 2238-2245
Publisher
Elsevier BV
Online
2009-12-04
DOI
10.1016/j.electacta.2009.11.075

Ask authors/readers for more resources

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search