Effect of Bubble Behavior on the Morphology of Foamed Porous Copper Prepared via Electrodeposition

Title
Effect of Bubble Behavior on the Morphology of Foamed Porous Copper Prepared via Electrodeposition
Authors
Keywords
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Journal
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 160, Issue 10, Pages D441-D445
Publisher
The Electrochemical Society
Online
2013-07-28
DOI
10.1149/2.019310jes

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