Effect of Bubble Behavior on the Morphology of Foamed Porous Copper Prepared via Electrodeposition

标题
Effect of Bubble Behavior on the Morphology of Foamed Porous Copper Prepared via Electrodeposition
作者
关键词
-
出版物
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume 160, Issue 10, Pages D441-D445
出版商
The Electrochemical Society
发表日期
2013-07-28
DOI
10.1149/2.019310jes

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