Additive-Assisted Nucleation and Growth by Electrodeposition

Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide

(2009) Wei-Ping Dow et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Preparation of Uniform Metal Seed Arrays for Nucleation Studies

(2008) Matthew Willis et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Effect of Additives on Shape Evolution during Electrodeposition

(2008) Yan Qin et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Island Dynamics Algorithm for Kinetically Limited Electrochemical Nucleation of Copper with Additives onto a Foreign Substrate

(2008) Ryan M. Stephens et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Electrocrystallization: Nucleation and growth of nano-clusters on solid surfaces

(2008) Alexander Milchev   RUSSIAN JOURNAL OF ELECTROCHEMISTRY

Evolution of Block Copolymer Lithography to Highly Ordered Square Arrays

(2008) C. Tang et al.   SCIENCE