Article
Chemistry, Multidisciplinary
Crystal E. Owens, Robert J. Headrick, Steven M. Williams, Amanda J. Fike, Matteo Pasquali, Gareth H. McKinley, A. John Hart
Summary: The study introduces a polymer-free, printable aqueous CNT ink and demonstrates the key relationships in the printing process. The printed lines have high conductivity, good flexibility, adaptability, and interactivity. Demonstrations show that this ink enables facile integration of electronic components.
ADVANCED FUNCTIONAL MATERIALS
(2021)
Article
Materials Science, Multidisciplinary
Alyssa L. Troksa, Hannah V. Eshelman, Swetha Chandrasekaran, Nicholas Rodriguez, Samantha Ruelas, Eric B. Duoss, James P. Kelly, Maira R. Ceron, Patrick G. Campbell
Summary: This study developed a ceramic ink compatible with both PμSL and DIW additive manufacturing techniques, allowing for the printing of 3YZ ceramic structures with engineered macro cavities, varying wall thicknesses, and nanoporosity. The research demonstrated the feasibility of using the same ink base for multiple AM techniques through facile composition changes without the need for separate cumbersome ink development processes.
MATERIALS & DESIGN
(2021)
Article
Chemistry, Multidisciplinary
Nicholas Schaper, Dheyaa Alameri, Yoosuk Kim, Brian Thomas, Keith McCormack, Mathew Chan, Ralu Divan, David J. Gosztola, Yuzi Liu, Irma Kuljanishvili
Summary: A novel approach of growing zinc oxide nanowires directly on single-walled carbon nanotubes and graphene surfaces has been demonstrated through the successful formation of heterostructure interfaces, showing the ability to control materials' placement and morphology.
Review
Chemistry, Multidisciplinary
Zhenbang Chu, Baohui Xu, Jie Liang
Summary: This article focuses on the challenges and developments in the application of CVD-grown carbon nanotubes in IC interconnects. Chemical vapor deposition is the most promising method for growing carbon nanotubes that can be compatible with integrated circuit manufacturing processes.
Article
Chemistry, Multidisciplinary
Alejandro Cortes, Alberto Jimenez-Suarez, Monica Campo, Alejandro Urena, Silvia G. Prolongo
Summary: This study developed a simple strategy to transform any structure into an efficient surface heater by applying low voltage to 3D printed nanocomposite circuits. The optimization of the printing process and exploration of different layers of circuits demonstrated excellent heating performance of four-layer printed circuits, suitable for long-term heating and deicing.
APPLIED SCIENCES-BASEL
(2021)
Article
Engineering, Electrical & Electronic
Yuki Susumago, Chang Liu, Tadaaki Hoshi, Jiayi Shen, Atsushi Shinoda, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima
Summary: This letter introduces a direct Cu bonding technology for three-dimensionally integrating heterogeneous dielets. By using SAP bonding, a large number of dielets can be stacked on thin 3D-IC chiplets. The letter also discusses key technologies to solve the yield issues of SAP bonding.
IEEE ELECTRON DEVICE LETTERS
(2023)
Article
Thermodynamics
Kaushal R. Parmar, K. K. Pant, Shantanu Roy
Summary: This study presents a regenerative approach for producing blue hydrogen and carbon nanotubes from natural gas, utilizing a synthesized catalyst in a fluidized bed reactor. The catalyst design considered fluidized bed reactor hydrodynamics and CNT extraction, with the catalyst successfully regenerated using ultrasonication. Advanced characterization tools such as 3D-Raman mapping were used to analyze and confirm the quality of the CNTs produced.
ENERGY CONVERSION AND MANAGEMENT
(2021)
Proceedings Paper
Engineering, Manufacturing
Sihang Ma, Abhishek Singh Dahiya, Ravinder Dahiya
Summary: This study presents a single-step method for fabricating reliable conductive tracks using high-viscosity conductive paste for the reliable interconnection of ultra-thin chips. The potential of this method for high-performance applications and heterogeneous integrated flexible systems is demonstrated through experiments.
2022 IEEE INTERNATIONAL CONFERENCE ON FLEXIBLE AND PRINTABLE SENSORS AND SYSTEMS (IEEE FLEPS 2022)
(2022)
Proceedings Paper
Thermodynamics
Pradeep Lall, Jinesh Narangaparambil, Kyle Schulze, Curtis Hill
Summary: This paper investigates the process-recipes and process-performance relationships for additive-printing of copper circuits using direct-write methods, with a focus on the photonic curing of copper ink and the impact of print process parameters on manufactured properties. The study demonstrates the feasibility of using copper ink as a cost-effective alternative to silver ink for creating conductive traces, highlighting the importance of understanding the effects of different photonic sintering profiles on mechanical and electrical properties. Additionally, the research explores the role of print process parameters in achieving desired line profiles for end applications, exemplified by the fabrication and testing of a flexible LC filter circuit with SMD components using an electrically conductive adhesive.
PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021)
(2021)
Proceedings Paper
Engineering, Electrical & Electronic
Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Summary: The development of component attachment methods with low-temperature processing is required for the realization of flexible hybrid electronics using additively printed circuits. This paper explores the process-performance-reliability relationships of different solders on copper metallization and investigates the use of photonic curing for sintering copper ink. The electrical and mechanical performance of additively printed circuits is studied, along with the intermetallics at the interface of low-temperature solder and printed circuits.
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)
(2022)
