Prerequisite for maximizing thermal conductivity of epoxy laminate using filler

Published 2012 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Prerequisite for maximizing thermal conductivity of epoxy laminate using filler
Authors
Keywords
Thermal Conductivity, PCBs, Boron Nitride, Print Circuit Board, Epoxy Matrix
Journal
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume 24, Issue 4, Pages 1095-1104
Publisher
Springer Nature
Online
2012-09-10
DOI
10.1007/s10854-012-0886-3
References
View 2 related references

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.