Prerequisite for maximizing thermal conductivity of epoxy laminate using filler

标题
Prerequisite for maximizing thermal conductivity of epoxy laminate using filler
作者
关键词
Thermal Conductivity, PCBs, Boron Nitride, Print Circuit Board, Epoxy Matrix
出版物
出版商
Springer Nature
发表日期
2012-09-10
DOI
10.1007/s10854-012-0886-3

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